Shanghai International Packaging Materials, Packaging Industry, Printing and Label Exhibition 2027

Dedicated to label printing and processing, highlighting new materials, products, and technologies in the label industry.

PACK FAIR 2027 is a comprehensive trade event covering the entire packaging industry chain. Scheduled to be held at the Shanghai World Expo Exhibition and Convention Center, the exhibition will feature over 650 packaging brand exhibitors and attract more than 60,000 professional visitors, including manufacturers, agents, and retailers from around the globe.

Main Thematic Zones & Exhibits

• PRINT TECH:Focuses on printing technology, showcasing the latest advancements in printing equipment and techniques.
• LABEL EXPO:Dedicated to label printing and processing, highlighting new materials, products, and technologies in the label industry.
• CIPPME:Features packaging products and materials, serving as a key trade platform for emerging markets in Asia, South America, the Middle East, and North Africa.
• INTPAK:Highlights smart packaging industry technologies and machinery, emphasizing intelligent and automated packaging solutions.

Wichtige Merkmale

Kategorie	Fokusbereiche
Verpackungsmaschinen	Automated packaging equipment, silk screen printing machines
Verpackungsstoffe	EPE foam, eco-friendly materials, corrugated boxes, thermal transfer ribbons
Smart & Green Packaging	Smart packaging, sustainable packaging, innovative structures

The event emphasizes "green smart manufacturing" and "circular economy," responding to global regulatory changes and the growing demand for sustainable, intelligent packaging solutions.

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Registrierung für Eingang oder Stände

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Standortkarte und Hotels in der Nähe

Shanghai - Shanghai-Weltausstellung-Zentrum für Ausstellungen und Konferenzen, Shanghai, China